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EH-MB06

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Wireless versions Bluetooth 5.1
Transmission power +7.5dB
Receiver sensitivity -90.5dB
Antennae Ext Antenna
Electricity 2.8V-6.5V
Weights 2.3g
Sizes 23.24 x 11.93 x 2.2mm
Accreditation BQB,FCC,CE,IC,KC,RoHs
Module IntroductionModule parameters

The EH-MB06 is a Bluetooth 5.1 enabled dual-mode audio module based on the   Qualcomm   QCC3021/QCC3031   chipset,a   chip   architecture   that   includes   tri-core processing   provided   by   two   dedicated   configurable   32-bit   application   processor   subsystems and a separate Qualcomm@KalimbaM DSP audio subsystem.

Supports   enhanced   audio   and   DSP   applications   (AAC,Aptx,SBC   codec,1-mic   CVC). Supports   GATT,A2DP,AVRCP,HSP,HFP,SPP   and   PBAP   features   for   connecting

with smart devices,dual wireless speakers and wireless audio   broadcasting with   low   latency.Feature-rich   Audio   Development   Kit   (ADK)and   enhanced   development   tools, customers can also choose the next rainbow AT instruction set and development

board   to   develop   products   quickly,and   the   module   through   the   BQB,FCC,CE,IC, KC,Rohs   certification,can   greatly   reduce   time-to-market.

ltem

EH-MB06

EH-MB06A

Chip

QCC3021

QCC3031

Stereo/Monc

Stereo

Power Consumption

<7mA

Programmable Apps CPU

Support

Apps CPU Max Speed

32MHz

DSP programmable

Configurable only

DSP Max Frequency

1*120MHz

DSP RAM

80kB(P)+256kB(D)

QualcommR aptXTM audio

No

aptX,aptX HD

QualcommR Broadcast Audio

Yes

QualcommR cVcTM noise cancellation

1-mic Speaker cVc included

Bluetooth Low Energy Speed

2Mbps(Bluetooth 5)

Qualcomm True WirelessTm Stereo

Qualcomm TrueWireless Stereo and Qualcomm TrueWireless Stereo+

Peripherals

UART*1

SPI*1

PIO*13

SPDIF IO*2

Digital MICs*4

PWM*6

Voltage

2.8V---6.5V

Dimension

23.24*11.93*2.2mm

Certification

BQB,FCC,CE,IC,KC,RohS