Detail

The EH-MW24 is based on the Qualcomm QCA4024 chip and supports BLE 5.0 + 802.15.4 dual-mode communication module, which is built specifically for running IoT applications on top of 802.15.4+ ZigBee or Thread. Additional BLE 5 support can be used for debugging or any other application utilizing BLE mesh connectivity.


The EH-MW24 has a dedicated Cortex-M0 microcontroller with 128KB SRAM and 384KB ROM as a Communication Processor (CP) to handle BLE and 802.15.4 at the MAC/PHY layer as well as a dedicated Cortex-M4F microcontroller with 704KB SRAM (328KB for applications) and 512KB ROM, an Application Processor (AP) running 802.15.4 upper layer protocol stacks such as ZigBee and Thread, application layer protocols and IoT applications. with dedicated memory, the Cortex-M0 can also be used as a Secure Processor (SP) to enable Trusted Execution Environment (TEE), thus enhancing security, which is increasingly becoming critical for IoT applications.


The EH-MW24 supports both ZigBee 3.0 (ZigBee PRO 2017 R22) and OpenThread 1.1 upper layer protocols built on the 802.15.4 stack. the core chip of the EH-MW24, QCA4024, is a Thread certified device. The latest Matter protocol from CSA has gained market support and industry adoption. The Thread-based Matter protocol has been added to the EH-MW24, allowing for easier and faster time to market for customers' products.


                FCC.png        CE.png                 Japan.jpg   SRRC.png         Rohs.png                 

   Module Parameters                                                                                         

    Wireless Features

   BLE and 802.15.4 Features   Hardware Features

  • Bluetooth 5.0 + 802.15.4

  • Maximum BLE transmission power: +4 dB

  • 802.15.4 transmission power: +10dB

  • Receiving sensitivity: -97 dBm

  • On-board antenna or U.FL

  • TX peak current (4dB): 12.5mA

  • RX peak current: 13.5mA

  • Sleep mode current: <900nA

  • IEEE802.15.4-2006

  • IEEE802.15-2015 CSL

  • Bluetooth 5.0 specification

  • Zigbee 3.0

  • BLE Profile 1.4a

  • Supports wireless over-the-air upgrades

  • UART,USB interface

  • SPI,I2C,PWM,UART,GPIO

  • 12-bit ADC

  • Operating temperature range: -30℃ to +85℃

  • Size:25*16*2.3mm

  • Operating voltage: 1.8-3.6V


 Software Features 

Microcontroller (MCU) Features

 Certification

  • Embedded with NextBest Ehware's protocol stack

  • OpenThread 1.1

  • Smart Home Protocol

  • Matter Protocol

  • EVK kit for developing multiple protocols


  • ARM Cortex-M4F

  • ARM Cortex-M4F

  • 704KB/128K SRAM

  • 512KR/384KB ROM

  • 4MB NOR Flash



  • BQB
  • FCC,CE
  • IC,SRRC
  • KC,RCM
  • TELTEC,RoHs


    Develop evaluation boards                                                                                                              

The EH-MEVK-MW24 development evaluation board is provided with the complete EH-MW24 module interface features. A quick manual guide allows you to get up and running and run the module in minutes to perform product performance for test and evaluation.